Altera Corporation has announced that the U.S. Department of State has certified that the company's HardCopy II structured ASIC design and manufacturing flow is compliant with International Trade in ...

The ever-increasing levels of CPU performance demanded by embedded applications and product design cycles that have often been reduced to only a few months, have made it important to produce ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it will showcase their FinFET ASIC solutions and ...

It is important to model an SoC well in advance to avoid costly over design or insufficient performance and to create a hardware emulation on which representative end user applications can be run. It ...

So you have an algorithm or a compute-intensive function you want to implement in hardware. Does that mean you have to go through the traditional ASIC design flow, writing register-transfer-level VHDL ...

As AI workloads move from cloud to edge, the volume of image and sensor data across industries is rising rapidly. Edge devices that previously relied on FPGAs and off-the-shelf modules are now running ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC's Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed ...

Orders were up for Emerson Process Management’s largest-selling product when a supplier of a critical ASIC component unexpectedly issued an end-of-life notice for its part. A major supplier of ...

As more designs hit the reticle limit, or suffer from decreasing yield, migrating to 2.5D designs may provide a path forward. But this kind of advanced packaging also comes with some additional ...

Flexible chiplet architectures and advanced packaging support efficient development of next-generation AI processors ...