Purdue University

Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

AI Processors Shift to System-Level Design with Alchip’s 3DIC Platform

Flexible chiplet architectures and advanced packaging support efficient development of next-generation AI processors Alchip ...
Purdue University

New institute accelerates future of microelectronic system integration, advanced packaging

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
Business Wire

indie Semiconductor Extends Automotive Photonics Leadership With Advanced Optical Component Integration Capabilities

ALISO VIEJO, Calif.--(BUSINESS WIRE)--indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, ...
Business Wire

Adtran brings advanced integration to OIF 400ZR+ demo at ECOC 2023

Adtran brings advanced integration to OIF 400ZR+ demo at ECOC 2023 News summary: Showcase of open network architecture features enhanced flexibility and 400ZR+ performance Adtran continues to champion ...
Morningstar

SeQent and Wunderlich-Malec Announce Strategic Alliance to Combine Mission-Critical Alarm Notification with Advanced System Integration and OT Network Expertise

TORONTO, Dec. 11, 2025 /PRNewswire/ - SeQent, a leading provider of industrial alarm notification and plant-floor communication software, and Wunderlich-Malec Engineering, Inc (WME), a nationally ...