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Atomic-scale chip alignment: Laser holograms could set new standard for 3D semiconductor overlay accuracy
Scientists at the University of Massachusetts Amherst have introduced a novel method for aligning layers in chips using lasers and metalenses. The new technique is claimed to achieve accuracy down to ...
Optically opaque materials present a series of challenges for alignment and overlay in the semi-damascene process flow or after the processing of the magnetic tunnel junction (MTJ) of a Magnetic ...
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