Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...
SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...
The latest version of Cadence Design System’s Encounter digital IC design platform includes chip optimisation, mixed-signal support for very large 65nm-and-below designs, and diagonal routing using ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its custom and analog/mixed-signal (AMS) IC design flow has achieved certification for Samsung ...
Internet of Things (IoT) applications depend on smart objects that interact with the real world. So your IoT project is likely to contain ICs that integrate micro electro-mechanical systems (MEMS), ...
Expanding partnership enables Cadence’s Design for AI and AI for Design strategy across TSMC’s N3, N2, A16 and A14 process nodes Developing “agent‑ready” digital and analog flows that integrate ...
Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...
For the most part, we’ve all been doing integrated circuit (IC) and system-on-chip (SoC) layout the same way for decades. Designers put together the design, be it intellectual property (IP), block, or ...
The integration flow and Virtuoso chip editor give designers an integrated physical design suite, from floorplanning through chip finishing and tapeout. It offers a seamless, bidirectional path to and ...
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