What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

Santa Clara, CA and Kyoto, Japan, March 21, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today introduced ultra-high-speed control IC technology that maximizes the performance of GaN and other ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

Tower ( (TSEM)) just unveiled an announcement. On November 12, 2025, Tower Semiconductor announced the expansion of its 300mm wafer bonding technology to support heterogeneous 3D-IC integration across ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

The booming development of AI applications is accelerating the advancement of IC process production, with fabless chipmakers also upgrading manufacturing specifications for their new products, ...

BEIJING, Dec. 21 (Xinhua) — Chinese scientists have made a breakthrough in cracking a key technology in constructing integrated circuits (IC), news which is expected to help pull up global market ...

Telechips has renewed its IC license for DivX video playback DivX, a pioneer in digital video technology, announced that DivX and Telechips have resolved their contractual dispute and Telechips has ...

Benefits of intelligent compaction. How intelligent compaction works. Key efficiencies gained with intelligent compaction. BOMAG's Terrameter technology in a roller cab. The California Department of ...

The majority of Taiwan-based IC design firms have said that they prioritize technological competency, geography, and other significant factors over cost when selecting how much to partner with Chinese ...