SK Hynix (000660) partners with NVIDIA on next-generation AI memory for supercomputers, personal AI, and robotics platforms ...
Lightbits Labs Ltd. today is introducing a new architecture aimed at addressing one of the most stubborn bottlenecks in large-scale artificial intelligence inference: the growing mismatch between the ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
Use left and right arrow keys to seek audio. Intel is re-entering the memory business, teaming with Japan's SoftBank on a next-generation DRAM bonding technology. Intel's Next-Generation DRAM Bonding ...
SK hynix announced iHBM today, a memory heat management technology designed to enhance AI system performance. The thermal packaging solution improves heat dissipation by integrating ICEs (integrated ...
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