For decades, packaging design has been a painstaking process, with designers and brands having to juggle multiple complex tools to complete just a single project. The outcome has often been riddled ...

AI packaging tools provider Pacdora is preparing to introduce a comprehensive AI-powered solution for design and marketing to transform the packaging creation process. With more than six million users ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Thanks in no small part to Apple, packaging design is a major part of the design process at many companies today. So when designing the new Xbox Adaptive Controller–a gamepad for people who might not ...

Digital twins dominated discussions at SEMICON West this year, appearing in keynote presentations, panel sessions, and workshops. The conversation reflected a noticeable shift in how the industry ...

Wilmington, MA. Rudolph Technologies Inc. announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process ...

In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

Siemens Digital Industries Software, a unit of Siemens AG, on Monday said it launched new software called Tessent Multi-die that automates a design process for testing chips made with advanced ...