Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Power electronics in the Industry 4.0 era are evolving to deliver higher efficiency and power density and simplify power design.

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

Kaynes Semiconductor is looking to expand into IC backend businesses as Kaynes Technologies' EMS business faces uncertainties due to US tariffs. India's Kaynes Semicon outlines OSAT roadmap from power ...

AUBURN HILLS, Mich., April 29, 2025 /PRNewswire/ -- BorgWarner is set to showcase its latest technology at the 46th Vienna Motor Symposium from May 14-16, 2025, at the Hofburg in Vienna and will lead ...

Good morning, good evening. Thank you all for attending the conference call with ASE. I'm Sunny Lin, covering Greater China [ Semis ] at UBS. It's my great honor to host Mr. Yin Chang, Executive VP of ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

China-headquartered solar cell and module manufacturer Jiangsu Sunport Power Corp., Ltd. has launched a lightweight module product at the Smarter-E trade show in Munich. The company’s new Full Black N ...