Researchers at the UCLA Samueli School of Engineering and CNSI (California NanoSystems Institute), led by Professor Aydogan ...

Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, ...

Researchers have developed a compact and lightweight single-photon airborne lidar system that can acquire high-resolution 3D images with a low-power laser. This advance could make single-photon lidar ...

A metamaterial (MTM) loaded compact three-dimensional antenna is presented for the portable, low-cost, non-invasive microwave head imaging system. The antenna has two slotted dipole elements with ...

Engineers have developed the first full, three-dimensional (3D), dynamic simulation of a rat's complete whisker system, offering rare, realistic insight into how rats obtain tactile information.

Current advanced imaging modalities with applied tracing and processing techniques provide excellent visualization of almost all human internal structures in situ; however, the actual 3D internal ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Power delivery has become one of the defining challenges of next-generation semiconductor systems. As AI, high-performance computing, and data-centric workloads drive higher performance and tighter ...

Contract award for Tiltan’s TOPS-NX state-of-the-art, physics-based 3D engine that provides infrared (IR) and visual (VIS) simulation capabilities for multi-domain unmanned aerial system (UAS) arrays ...

Northwestern Engineering researchers have developed the first full, three-dimensional (3D), dynamic simulation of a rat’s complete whisker system, offering rare, realistic insight into how rats obtain ...