Ring-oscillator process monitors give production test teams a fast on-die frequency measurement for identifying CMOS process variation and sorting dies at wafer level. A process monitor is a dedicated ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

The high costs of building, resourcing and operating a foundry fabricating integrated circuits are well known. Fabless companies avoid this capital cost and focus on design and innovation in their ...

Device test times also are rising dramatically. Longer test times are driven by higher levels of embedded memory, higher functionality, higher quality requirements, and the need to move more tests to ...